RFX1010

700 / 800 / 900MHZ 0.5 WATT BROADBAND CMOS RFEIC


The RFX1010 is a broadband, fully integrated, single-chip, single-die RFeIC (RF Front-end Integrated Circuit) which incorporates all the RF functionality needed for a TDD-mode RF front-end operated in the 700/800/900MHz frequency bands.

The RFX1010 architecture integrates a linear PA, LNA, Transmit and Receive switching circuitry, associated matching networks, and harmonic filters all in a CMOS single-chip device. The RFX1010 requires minimal external components including the power supply bypass capacitors.

This RFeIC is designed for medium to high output power, and consumes low current in receive mode. The combination of superior output power, high sensitivity and efficiency, low noise, small form factor and low cost makes RFX1010 the ideal solution for multiple applications including IEEE 802.15.4, ZigBee, AMR, Smart Home Area Network and other ISM applications in the sub-GHz bands from 780 to 960MHz. It can also be used for IEEE 802.11p and 802.11ah.

Specifications

Product LifecycleIn Production
RF Frequency (MHz)780-960
Rx Insertion Loss (dB) Typ.
Rx Gain (dB) Typ.14 / 12
Tx Gain (dB)28
Rx NF (dB) Typ.3 / 3.5
Saturated Output Power (dBm) Typ.27
Supply Voltage (V)
Package
Package (mm)3 x 3

Features

  • 700/800/900MHz Single-Chip, Single-Die RF Front-End IC
  • Separate TX and RX RF Transceiver Ports and Single Antenna Port
  • 700/800/900MHz Power Amplifier with Low-Pass Harmonic Filters
  • Low Noise Amplifier
  • Transmit/Receive Switch Circuitry
  • High Transmit Signal Linearity Meeting Standards for OQPSK Modulation
  • Low Voltage (1.2V) CMOS Control Logic
  • ESD Protection Circuitry on All Pins DC Grounded RF Ports
  • Internal RF Decoupling on All VDD Bias Pins
  • Low Noise Figure for the Receive Channel
  • High Power Handling Capability for Received Signals
  • Very Low DC Power Consumption
  • Full On-chip Matching and Decoupling Circuitry
  • Minimal External Components Required
  • 50-Ohm Input / Output Matching
  • Market Proven Low Cost CMOS Technology
  • 3 x 3 x 0.55mm Small Outline QFN-16 Package with Exposed Ground Pad

Product Documents

Applications

Smart Cities

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Connected Homes

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