SKY5A2206

Low-, Mid-, High-band (LMH) Multimode/Multiband Power Amplifier Module

The SKY5A2206 LMH multimode/multiband power amplifier module for LTE and NR Bands offers a complete 3G/4G/5G power amplifier (PA) for automotive and telematics NAD or CPE. The SKY5A2206 consists of PA blocks for low-, mid-, and high-bands, a logic control block for multiple power control levels, and band-enable functions. The SKY5A2206 is part of our Sky5® product portfolio.

RF I/O ports are internally matched to 50 Ω to minimize the number of external components. Extremely low leakage current maximizes standby time.

The InGaP/GaAs PA die, CMOS controller, and SOI switch die and passive components are mounted on a multilayer laminate substrate and the assembly is encapsulated in a plastic over-mold.

The SKY5A2206 meets spectral linearity requirements of NR modulation with DFT and CP OFDM modulation, with up to 256 QAM constellations.

The SKY5A2206 supports resource block allocations within 3GPP defined transmission bandwidth specifications, with good power-added efficiency.

Product Summary
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SKY5A2206 block diagram
SKY5A2206 block diagram

Specifications

Product LifecycleSamples Only
DescriptionSky5® TX/RX Front-end Module with 15 Linear TRx Switch Ports (No 2G Integration)
ArchitectureSky5® TX/RX Front-end Module with 15 Linear TRx Switch Ports (No 2G Integration)
PackageLGA, 32-pad
Package (mm)4.2 x 4.3 x 0.70

Features

  • P2P compatible with SKY5A2204
  • TX harmonics below –40 dBm
  • 15 low loss/high linearity/high isolation TRx switch ports
  • RF input switching to external 5G/4G/3G path
  • Integrated directional coupler with forward directionality
  • Dual antenna downlink inter-band Carrier Aggregation (CA) support with dedicated LB and M/HB antenna ports
  • Built-in IEC-compliant antenna ESD protection
  • RF ports internally matched to 50 Ω with 0 DC offset
  • Fully Baseband Agnostic Design:
    • MIPI RFFE control with dual-standard support
    • User-selectable register mappings
  • Automotive support:
    • Production Part Approval Process (PPAP)
    • AEC-Q104 qualification
    • International Material Data System (IMDS)
  • Small, low profile land grid array (LGA) package:
    • 5.5 mm x 5.5 mm x 0.755 mm
    • 44-pad configuration

Product Documents

Applications

Automotive

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Cellular Telematics

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